Capabilities:

Analysis of morphology, crystallography, and composition of bulk and nanoscale materials.

Specifications:

Source:

• Ultra-high brightness cold field-emission-gun (X-CFEG) with X-Twin objective lens providing a superior energy resolution
• Fully computer-controlled and automated projector screen and apertures

Detector:

• Annular bright field (ABF) and high angle annular dark field (HAADF) Panther STEM detector
• Bruker Super-X EDS windowless detector with a detectability down to boron

Resolution:

• TEM information limit: ≤ 0.11 nm
• TEM line resolution: ≤ 0.10 nm
• STEM resolution: ≤ 0.14 nm
• EDS energy resolution: ≤ 140 eV

Magnification:

• TEM mode: 25 – 1.05 Mx
• STEM mode: 310 – 330 Mx
• Field of view: 2 ± 0.1 mm at zero degrees for both alpha and beta tilt
• Maximum diffraction angle: 24o

Field of View:

• TEM mode: 25 – 1.05 Mx
• STEM mode: 310 – 330 Mx
• Field of view: 2 ± 0.1 mm at zero degrees for both alpha and beta tilt
• Maximum diffraction angle: 24^o

Operation Voltage: 80 and 200kV

Stage:

• Fully computer-controlled, eucentric side-entry, high stability CompuStage
• Single and double tilt specimen holders and heating and cooling holders

Camera:

• Ceta-S 4k x 4k CMOS camera

Software:

• Velox data acquisition and processing software
• Inspect 3D for tomographic reconstructions
• TEM/ STEM/ EDS tomography data acquisition software
• Avizo for EM systems (Materials Science)

for imaging services, training or other questions

please contact Dr. Hansoo Kim, luminesc@tamu.edu.

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Helpful Hints:

To acquire good images on the TEM sample thickness should typically be ≲100nm.